An Ultra-Fast Annealing Treatment by Electropulsing during Pure Copper Wire Drawing

Influence of an Inclusion on Multi-Pass Copper Shaped-Wire Drawing by 2D Finite Element Analysis

The size and length effects of an inclusion on multi-pass copper shaped-wire drawing were investigated. For this purpose, an experimental investigation on optimal die half-angle was conducted. Based on experimental data of optimal die half-angle, wire and inclusion deformations, drawing and hydrostatic stress of copper shaped-wires that contain an inclusion were calculated by two-dimensional fi...

Ultra Low Loop Wire Bonding of 20 μm Palladium Coated Copper Wire for Very Thin Packages

In 1998, Carsem introduced the MLP (Micro Leadless Package). Today, the MLP has become the semiconductor industry’s package of choice for many devices with low-tomedium I/O count. Coincidentally, the MLP came out at the same time that smartphones were just starting to take off. Following the tremendous increase in market demand for smartphones, tablets and other handheld devices, the MLP soon o...

Palladium - coated and Bare Copper Wire Study for Ultra - Fine Pitch Wire Bonding

Wire bonding using copper wire

Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...

Lawd – Laser Assisted Wire Drawing

In conventional wire drawing the diameter of a wire or rod-like workpiece is reduced by drawing it through a conical die. Dieless drawing of a wire or a rod is realized by a localized heating of the work piece. As heat source for example an induction coil can be used. Immediately after having passed the heating zone the work piece is cooled to restrict the heat input on very small region. By ap...